Production & Test Equipment

Component Marking Systems

Simac Masic & TSS offers a range of marking systems suitable for electronic components and other products. The laser markers can be configured and built into a turnkey solution for your application. The offset marking systems are dedicated to marking semiconductor packages including DIP's, SOIC and other surface mount packages

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Laser Marking

laser marking systems from LS laser systems

Offset Marking Systems

ME-3000 Semi-automatic DIP, SOJ and SO Marking System

This marker module is the same as that used in our fully automated marking systems. The marker is a compact, portable, tabletop unit. It can mark almost any flat or semi-flat component surface. Quick-change nests allow for accommodating an almost limitless variety of component configurations including surface mount devices. Operation is completely safe due to our pressure-limiting feature on the marker module. The machine is manually loaded, foot pedal activated, and manually unloaded by an operator.

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Simac Masic & TSS supply laser and offset component marking systems for semiconductor and other packages