| Model
SWC 111 - Sawed / Scribed Wafer Cleaner
DESCRIPTION:
The highly efficient Model SWC111 is the ideal solution
for submicron cleaning of sawn wafers, scribed wafers
and other substrates. This very reliable and cost effective
system utilizes a proven High Pressure De-ionized Water
Spray. The Rapid and Effective Drying technique combines
High Spin Speeds, Nitrogen Assist and an Infrared Heat
Lamp. The SWC111 is capable of processing wafer output
of up to three saws while cleaning consistent with the
most rigorous bonding and packaging requirements effectively
removing debris from the wafer sawing process.
FEATURES:
Up to Eight
(8) Inch Wafer Compatibility including Unmounted Wafers
as well as Tape Ring and Film Frame mounted Wafers
Oscillating High Pressure D.I. Water Fan Jet Assembly,
adjustable to 2500 PSI, for Effective and Efficient
Cleaning
Nitrogen Blow-off for Rapid and Effective Dry
Infrared Heat Lamp for Complete Drying
Built in Vacuum Wafer Hold-down
Efficient Chamber Exhaust and Drain
Nitrogen Wafer Lift at end of cycle
D.I. Water Line Purge
Built-in Exhaust Blower
Built-in Safety Interlocks and Positive Lid Locking
During Process Cycle
CE marked
for use in Europe
|
