Simac
Masic & TSS bv has a long history of supplying semiconductor
manufacturing equipment to facilities throughout Europe. This
includes die shear and bond pull testers; burn-in
equipment capable of testing logic and memory devices
during burn-in; cleaners for flat
screens, photo masks, sawed and scribed wafers; IC package
inspection systems and media transfer systems;dicing
saw blades; laser trimmers and markers;
performance boards for testing devices
at very high edge speeds; environmental chambers.
From
our national offices we can supply not only equipment but
full service and applications support. So we can advise you
on the appropriate equipment, install it if appropriate and
provide after sales support whilst the equipment is under
warranty and beyond.
If
you require any further information on our principals and
products listed below please contact
us or make use of the hotlink to the principals site where
available.
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AE
Advanced Engineering is an expert manufacturer
of wafer handling products for the dicing environment,
specializing in wafer mounters (including films and
frames), UV curing systems, (after dicing) wafer cleaners
and material handling systems (MHS). Website: www.eshal.com
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AMS / UCT (Ultra Clean Technology Asia
Pte) is an recognised leader in the design, engineering
and manufacture of Compact Mini Washers (CMW) for wet
processing of silicon wafers and multichip substrates.
Next to separate compartments for acid and other wastes,
standard and custom baths, spinners, dryers, (quick dump)
spray rinsers etc. are available. UCT is part of the ASM
group of companies.
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AST Products, part of AST (Advanced
Surface Technology), is one of the largest manufacturers
of contact angle systems for surface analyses. The VCA
(video contact angle) Systems can measure the absorption
or adhesion of vapors and liquids to solid surfaces and
is suited for semiconductor process and quality control
as well as other areas like (bio)materials research and
chemical science.
Website: www.astp.com
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ATM
produces component taping systems (tape & reel);
inspection systems (including through tape inspection);
media transfer systems (stick or tray to tape &
reel); lead conditioning systems for most semiconductor
package styles. Website: http://www.americantech.com |
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Corad
Technology High quality tester performance boards
for semiconductor testers and lab set-ups. Standard
boards and custom designs at very competitive prices.
All commercially available testers, sockets and handlers
supported. Website: http://www.corad.com |
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Finetech’s
Fineplacer is one of the best high-precision rework
systems available on the market with micrometer precision.
Thanks to the Comiss IV local heating system best results
are guaranteed, especially in the lead-free rework.
Finetech also delivers high-accurate flip-chip and opto-bonding
solutions. www.finetech.de
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GGB
Industries Manufacturers of world-renowned
Picoprobe® and probe tips for analytical wafer probing
of semiconductor wafers. Models available for microwave
probing etc. |
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Hirayama is a long-term
manufacturer of HAST (Highly Accelerated Stress Test)
and PCT (Pressure Cooker Test) equipment for reliability
testing in the semiconductor sector. The systems feature
a.o. temperature range from 105 to 162.5 ºC, 3 exhaust
modes, independent-double-chamber systems, external bias
terminals, and an easy-to-use user interface.
Website: www.hirayama-hmc.co.jp
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Instec
manufactures high precision temperature controllers,
microscope hot/warm/cold stages with a great temperature
range, and hot-chuck systems for probing, characterization
and failure testing of semiconductor wafers and LCDs
(Liquid Crystal Displays). Website: www.instec.com
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Kinetic Systems offer
state-of-the-art vibration isolation and control systems
and optical tables for applications in aerospace, medical
research, metrology, laser R&D, and semiconductor
equipment. Semiconductor test and inspection, wafer probing
and mask aligning systems will have a smooth, quiet operation
on the variable height, vibration isolation table workstations.
Website: www.kineticsystems.com
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Kulicke & Soffa. K&S manual
wire bonding solutions integrate digital and analog programming
options for maximum yields and reliability. A full
range of features and capabilities are available for
ball & wedge bonding, security bonding, coining,
single point TAB, and ball bumping applications.
Website: http://www.kns.com
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LS
Laser Systems. Manufacturers of laser trimmers and
marking systems using both conventional and diode-pumped,
YAG lasers. Diode-pumped laser trimmers run off a 13
amp single-phase supply and do not require cooling water
and they fit onto a desk yet the quality of trim is
not compromised. The argon-pumped laser has higher power
for really high throughput requirements. Laser markers
can put text or graphics onto most materials permanently.
Visit their website at http://www.ls-laser-systems.com
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Micro
Control Company. ABES burn-in systems go well beyond
dynamic burn-in, they allow test patterns to be generated
at the device inputs and its outputs to be compared
to the expected results just like a VLSI tester. Suitable
configurations are available for memory, logic and analog
devices. Burn-In boards and burn-in board testers are
also available. Website: http://www.microcontrol.com
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Optronics
real time imaging products are useful for imaging of
semiconductor die in failure analysis laboratories.
This is especially useful with poor contrast soft focus
images. Website: http://www.optronics.com
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PSI
(Probing Solutions) has been providing high-quality
as well as low-cost analytical probing equipment and
photo mask inspection stations since 1995, designed
for failure analysis, wafer-level reliabitily and/or
tests on packaged parts. This includes probe stations;
microscopes; manipulators & probes; ambient, low-noise
and hot/cold chucks; and laser cutters.
Website:
www.probingsolutions.com
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Sun
Electronics Systems Manufacturers of both
process controllers and environmental chambers. In particular
applications that involve the most complex of temperature
cycling programs; all of which are covered by EC series
environmental chambers. The PC series process controllers
allow precise control and monitoring of such factors
as temperature, humidity and pressure.
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Temptronic
Systems to test, cycle and failure-analyze components,
modules, PCBs or wafers at precise temperatures between
-80 and +225 degrees Celsius (with an air stream) or
-65 to +400 degrees Celsius (with a wafer chuck).
Website: http://www.temptronic.com
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Thermocarbon
Manufacturer of resin-bonded diamond dicing saw
blades used for cutting hard and brittle materials such
as ceramics, glass, lithium niobate. They also supply
flange lapping kits to repair worn flanges. Website:
http://www.dicing.com
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Ultra
t Equipment produces manual and automatic cleaners
for photomasks, substrates, scribed and sawn wafers;
ink dot-removing systems, spin coaters, photo resist
developing stations, Website: http://www.ultrat.com |
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Wicha-Linner
Elektronik develops, manufactures and markets
electronic systems for burn-in, measuring and control
systems.
Website: www.wicha-linner.de
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XYZTEC
has produced a new generation of bond testers. The Condor
150 multifunctional bond tester automatically selects
the appropriate pull or shear tool and measuring sensor
by using a revolving head. Pull or shear testing to
100Kg for wire pull, tweeze pull, ball shear, wedge
shear, solder ball shear and die shear. http://www.xyztec.com |
Simac Masic & TSS bv specialises in supplying
equipment to semiconductor manufacturing facilities throughout
Europe.
