| Description
The highly efficient Model SCS133i is the ideal solution
for submicron cleaning of Photomasks, Wafers and Substrates.
The very reliable and cost effective system utilizes
a proven High Pressure De-ionized Water Spray with optional
Fixed or Oscillating Surfactant Dispenses and a Brush,
that incorporates Self Cleaning. The Rapid and Effective
Drying technique combines Variable Spin Speeds with
Nitrogen Assist and a Heat Lamp. The System also makes
available a Photoresist Stripper option. The SCS133i
has a Microprocessor Controller allowing variable process
parameters and retention of multiple process programs
in memory.
Features
Compatible
with Substrate of Up to 21inch diagonal
Programmable Microprocessor Controlled Process
Oscillating High Pressure D.I. Water Jet, of up to 2500
PSI, having 0.2 µm Filtration for Effective
Three (3) Adjustable Spin Speeds
N2 Drying Assist with 0.02 µm Filtration
Infrared Heat Lamp for Complete Drying
Efficient Radial Chamber Combined Exhaust /Drain
Built-in Exhaust Blower for Consistent Results
D.I. Water Line Purge for a Bacteria Free System
Built-In Safety Interlocks
Options
Various sizes
of vacuum chucks for wafers
Adjustable Self Cleaning Brush Assembly having Up-to
Two Dispenses and Nylon Brush Material
CO2 Re-ionizer for Elimination of Static Charge
Fixed or Oscillating Low Pressure Dispenses
Surfactant Dispense Canisters
0.2 µm Filtration for Low Pressure Dispenses
Photoresist Stripper Conversion
Nitrogen Ionizer
Ocillating Megasonic DI Water Dispense Arm
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